The EvoNexus SIG Presents...
Partnering Opportunity with InterDigital
DATE:
Wednesday, December 15th, 2010
7:30am - 9:30am: Session 1, Presentation from InterDigital (attendance is free and open to all registrants)
10:00am - 5:00pm: Session 2, Opportunity to pitch your company and technology to InterDigital (accepted applicants only)
LOCATION:
CommNexus San Diego
4225 Executive Square, Suite 495
San Diego, CA 92037
COST:
FREE to ALL attendees
Who InterDigital is:
InterDigital (NASDAQ: IDCC) has formed partnerships and licenses with many of the world’s leading wireless companies, including Samsung, LG, RIM, Apple, HTC, Nokia and NEC. The company develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. InterDigital’s modem cores, air interface technology and mobility middleware have enabled consumer electronics giants shorter time to market with high volume, price sensitive products. As a long-standing contributor to the evolution of the wireless industry, we solve many of the industry’s most critical and complex technical challenges years ahead of market deployment. Our advanced solutions support more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities.
InterDigital, with a market capitalization of approximately $1.4 billion, has its headquarters in King of Prussia, PA and additional development facilities in Melville, New York and Montreal, Canada. Please visit InterDigital’s website for more information: www.interdigital.com.
The InterDigital team attending:
William J. Merritt - President and Chief Executive Officer
Naresh Soni - Chief Technology Officer
Mark A. Lemmo - Executive Vice President, Corporate Development
James J. Nolan - Executive Vice President, Research and Development
Michael W. Regensburg - Executive Vice President, Advanced Products
Please visit the website for extended bio's of the InterDigital team.
InterDigital (NASDAQ: IDCC) has formed partnerships and licenses with many of the world’s leading wireless companies, including Samsung, LG, RIM, Apple, HTC, Nokia and NEC. The company develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. InterDigital’s modem cores, air interface technology and mobility middleware have enabled consumer electronics giants shorter time to market with high volume, price sensitive products. As a long-standing contributor to the evolution of the wireless industry, we solve many of the industry’s most critical and complex technical challenges years ahead of market deployment. Our advanced solutions support more efficient wireless networks, a richer multimedia experience, and new mobile broadband capabilities.
InterDigital, with a market capitalization of approximately $1.4 billion, has its headquarters in King of Prussia, PA and additional development facilities in Melville, New York and Montreal, Canada. Please visit InterDigital’s website for more information: www.interdigital.com.
The InterDigital team attending:
William J. Merritt - President and Chief Executive Officer
Naresh Soni - Chief Technology Officer
Mark A. Lemmo - Executive Vice President, Corporate Development
James J. Nolan - Executive Vice President, Research and Development
Michael W. Regensburg - Executive Vice President, Advanced Products
Please visit the website for extended bio's of the InterDigital team.
SESSION 1:
Presentation from InterDigital - Creating Tomorrow's Network of Network
Time: 7:30am - 9:30am - continental breakfast provided
Creating Tomorrow's Network of Networks
InterDigital executives will present a company overview and provide an in-depth look at its technology roadmap. With an eye on the future, InterDigital extends an invitation to companies across the wireless ecosystem to collaborate on solving some of the toughest technical challenges that will help shape the future of wireless.
Today, our vision of tomorrow’s Network of Networks guides InterDigital’s internal R&D efforts, partnerships and targeted investments. Our holistic approach to solving the wireless bandwidth crunch is focused on three comprehensive areas of innovation: spectrum optimization, cross-network connectivity and mobility, and intelligent data delivery techniques. In simpler terms, you can think of it as bigger pipes, more pipes, and better pipes. In order to solve the significant bandwidth demand being placed on wireless networks by smartphones, netbooks, tablets and the like, we envision a seamless integration of multiple communications networks, including both cellular and non-cellular air interfaces, that intelligently and constantly connect people and things across a myriad of wide, local, and personal area networks.
Featured Speakers:
William J. Merritt - President and Chief Executive Officer
Naresh Soni - Chief Technology Officer
James L. Nolan - Executive Vice President, Research and Development
Please note registering for SESSION 1 does not guarantee you a private meeting with Interdigital.
If you would like to apply for a partnering opportunity, please apply through SESSION 2 (see below).
SESSION 2:
Opportunity to Pitch your Company and Technology to InterDigital
Time: 10:00am - 5:00pm - Accepted Applicants Only
There are up to 10 spots available for 30-minute presentation meetings with Interdigital. Applicants will be notified one week prior to the event if accepted. No late applications will be accepted.
What InterDigital is Looking For:
We are forming collaborative partnerships with fellow market participants and making targeted investments in the wireless ecosystem to complement our own technology roadmap. Areas of interest include:
· Spectrum Optimization: accelerate the wireless standards evolution through improved spectral efficiency and advanced network topologies and architectures
· Connectivity and Mobility: seamlessly integrate heterogeneous networks, using cognitive radio techniques and leveraging of TV white space and unlicensed spectrum
· Intelligent Data Delivery: create more efficient data distribution through advanced compression, caching, and routing schemes
· Advanced Convergence Technologies: enable innovation in location and context-aware solutions, video and audio compression, and machine-to-machine deployments.
This program is designed to provide a shortcut to developing new relationships by orchestrating a simple and efficient introduction process that offers selected companies the opportunity to present to executives focusing on new products and innovations in a personalized 1-on-1 session. All applications are reviewed by the host company through a web-based collaboration program and the company, not CommNexus, selects the top application companies that they would like to most meet with.
Applications will be reviewed and accepted on a rolling basis, so apply early.
Application submission deadline EXTENDED TO FRIDAY, DECEMBER 10
Date:
Wednesday, December 15, 201010:00 AM - 5:00 PM
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