The Semiconductor SIG Presents...
SiP vs. SoC
A few years ago, SoC would have scored a quick KO. But with soaring system-on-chip engineering and tooling costs, shrinking market windows, and the need to combine multiple semiconductor technologies into ever-smaller consumer products, system-in-package technology is now a serious contender. If you're involved in large-scale IC design, or if your products depend on it, you'll want to attend this two-hour event and get a quick update!
MODERATOR
Skip Powers
As business development manager and program manager with Conexant Systems spin-off Skyworks Solutions, Inc., [NASDAQ: SWKS], Skip was responsible for managing a multi-national, multi-company team developing integrated circuits and software for GSM handsets, and for evaluating and licensing technologies to augment Skyworks’ core competencies. As director of Bluetooth products for RangeStar Wireless (now part of TYCO), he helped establish the company’s position as the leading supplier of embedded antennas for Bluetooth wireless devices. A Co-Founder and Director of corporate development of Silicon Wave (acquired by RF Micro Devices, then by Qualcomm), Skip authored the company’s initial and subsequent-round business plans, which raised $57 million in corporate and venture-capital funding. Prior to co-founding Silicon Wave, Skip held several positions in marketing and product development with Peregrine Semiconductor Corporation, where he was a key participant in the development of the company’s business plans and product strategies, raising more than $20 million in several private offerings. Skip also co-founded and served as chairman and CEO of Xtar Corporation. Recent projects include developing a test plan for GPS/Bluetooth coexistence tests, for a major instrumentation manufacturer, and a study funded by the National Science Foundation to investigate the interference effects of Bluetooth devices on 802.11b wireless networks in retail environments.
PANELISTS
Charlie Persico, VP RF Engineering
Entropic
Mr. Persico has over 22 years of engineering experience and a wealth of RFIC expertise. Prior to joining Entropic, Mr. Persico was the Senior Vice President of Engineering at Qualcomm Inc. where he managed all RF, analog and mixed signal IC design, product and test engineering functions. At Qualcomm, Mr. Persico built the RF engineering team from one to over 350 engineers and led the team to become the number one RFIC supplier worldwide, shipping over 750 million RF/Analog ICs annually and generating annual revenue in excess of one billion dollars. Prior to joining Qualcomm, Mr. Persico held a variety of engineering roles at leading technology companies including Philips Semiconductors, Trimble Navigation, AT&E, Honeywell Space Systems and General Electric Avionics systems. Mr. Persico is an inventor on numerous issued and pending patents, a contributing author in several technical publications and has participated in several IEEE conferences. Mr. Persico received his B.S. in Electrical Engineering from Union College and M.S. in Electrical Engineering from Syracuse University.
Lee Smith, Sr Director - Laminate Bus Dev
Amkor
Lee is recognized as an industry expert in 3D packaging, with over 27 years of diverse technology and end market applications experience.
Over the past 10 years Lee held 3D packaging technology, infrastructure and business development responsibilities at Amkor, Texas Instruments and Tessera with market emphasis in mobile handsets. Lee has authored or co-authored numerous patents, technical papers and industry articles. Authored the Stacked / 3D Packages chapter in McGraw-Hill’s “Area Array Packaging Handbood,” and has taught 3D packaging workshops at SMTA conferences.
Lee was responsible for definition, development and deployment of the package on package (PoP) technology. Successfully drove the supply chain co-development of PoP to achieve 15 months from concept to production launch. Lee has been instrumental in the infrastructure development for PoP including JEDEC standard development, stacking process capabilities and board level reliability reports.
Jean-Philippe (JP) Kielsznia, Director of Hardware Engineering
Sierra Wireless
Jean-Philippe Kielsznia has over 15 years of engineering experience in design of wireless consumer products. Prior to Sierra Wireless, JP was at Denso International America were he assembled the base-band engineering team to develop and introduce to market several CDMA handsets. In the years since joining AirPrime in 2000 (AirPrime was acquired by Sierra Wireless in 2003), JP assembled the hardware engineering team to develop and commercialize multiple CDMA and EVDO wireless terminals, such as modules and cards. Nowadays he also often leads early product concepts and new technology evaluations. JP received his Electrical Engineer degree at Ecole Supérieure d'Ingénieurs en Electrotechnique et Electronique in France (including one year at Harvey Mudd College), and his M.S. in Electrical Engineering from Polytechnic University of New York.
WHEN
Friday, September 14, 2007
AGENDA
7:00AM - Registration & Continental Breakfast
7:30AM - Event Begins
9:00AM - Event Ends
EVENT HOST
12390 El Camino Real, San Diego, CA 92130
COST
$ 10.00 Pre-registration
Please pre-register before noon on September 13, 2007
$ 20.00 At-the-door
Skip Powers, co-founder, Silicon Wave
Anton Monk, Entropic
Ann Buckingham, Latham & Watkins
Rory Moore, co-founder, Peregrine Semiconductor & Silicon Wave
Beth Altman, KPMG
Nancy Kemper, HNS
Date:
Friday, September 14, 20077-9am
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